Fair-Rite Policies

Our Position on Quality and the Environment

Modern value enhancement tools, including Controls Plans, Advanced Product Quality Planning (APQP), Production Part Approval Process (PPAP), Failure Mode and Effects Analysis (FMEA) and Feasibility Assessments, are available for the quality planning process. Contract review, design control, and procurement all function within the quality management system. Process and product control, including measurement, traceability, handling and delivery, meet the highest quality standards. Any nonconforming or suspect product is tracked. Corrective and preventive actions, statistical methods, and internal audits are applied to guarantee continual improvement. Extensive training is provided to all employees to support the system. Product inspection, tests and records verify that specified requirements are met. Critical characteristics are monitored by statistical methods, including pre-control, control charts, and Statistical Process Control (SPC). Process capability indices, Cpks, are targeted to exceed 1.33. When sampling plans are employed, Zero Based Acceptance (C=0) criteria is used. Visual inspection criteria for chips, cracks and surface finish are documented. IEC Standard 60424 is used as a guide for evaluation of visual imperfections. For product types not defined by IEC Standard 60424, customer specific or Fair-Rite’s visual inspection criteria shall apply.

All Fair-Rite Products Corp. components are RoHS and REACH compliant per the current substances and thresholds. Termination wire used on all board level components and the plated contacts on chip components have 100% matte tin surface finish over a nickel undercoating. The polypropylene cases used to assemble Fair-Rite Snap-It cores are UL94 V-0 rated, do not contain PBB nor PBDE but do contain Antimony Trioxide as a flame retardant.